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Professors Jae-Hyoung Park and Seung-Ki Lee transfer technology in the field of semiconductor processing
Writer 국제교류팀 최지영
Date 2023.02.02
View Count 438
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The Industry-Academic Cooperation Foundation (IACF) at Dankook’s Jukjeon campus transferred core technology needed in semiconductor processing to Mntek.Co., Ltd, a next-generation sensor company. The transferred technologies, ‘interconnection structure through substrates and its fabricating method’ and ‘packaging technology for devices with interconnection structures through substrates,’ are from professors Jae-Hyoung Park and Seung-Ki Lee (Department of Electronics and Electrical Engineering). The royalty for the transfer of this Korean and U.S. patented technology is KRW 100 million.



This technology etches the top of silicon substrates where semiconductor devices are fabricated to create micro patterns which are sealed with glass substrates. Afterward, the glass reflow technique is applied to fill in the microstructures. This can be used for the fabrication and packaging of semiconductor devices with multi-layer structures. When applied, it can significantly reduce semiconductor signal losses in semiconductor fabrication, as well as lower device production costs and decreases in the size of the overall structure by nearly half.


“Glass reflow technology is applied to enable formation of interconnection structures of various sizes from 25 to 50㎛ and 300㎛ tall through glass substrates at the wafer level,” explained professor Park who added that it boasts stable structure and excellent electrical properties.



Professor Seung-Ki Lee and Jae-Hyoung Park’s research teams study MEMS (microelectromechanical systems) technology that are applied to various fields including micro and nano devices based on semiconductor process technology, bio sensors, and wafer-level packaging.